Detail akcie BE Semiconductor Depository Receipt online

Business Summary: BE Semiconductor Industries N.V. (Besi) is a holding company. The Company is engaged in the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. It operates through three segments: Die Attach, Packaging and Plating. It develops assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a range of end user markets, including electronics, computer, automotive, industrial and solar energy. The Company offers products, such as Die attach equipment, which include single chip, multi-chip, multi module, flip chip, thermo-compression bonding (TCB) and enhanced wafer level ball grid array (eWLB) die bonding systems, and die sorting systems; Packaging equipment, which include wafer level molding and singulation systems, and Plating equipment, which include metal plating systems and related process chemicals.
Financial Summary: BRIEF: For the three months ended 31 March 2024, BE Semiconductor Industries NV (ADR) revenues increased 10% to EUR146.3M. Net income decreased 2% to EUR34M. Revenues reflect China segment increase of 56% to EUR58.5M, EU / USA / Other segment increase of 18% to EUR44.2M. Net income was offset by Share-based compensation expense increase of 82% to EUR16.9M (expense), Selling, general and admini increase of 16% to EUR22.7M (expense).